3D MID

 

3D MID

The Cuptronic Process™ can be applied to the production of 3D MIDs (Molded Interconnect Device) on a wider range of materials than has previously been possible. This allows for the use of more inexpensive materials and plating on smoother surfaces with excellent edge definition and no creation of dust.

The MID technology is commonly used in consumer electronics, telecommunications, automotive and medical applications.