The Cuptronic Process™ has been adjusted to not only work with traditional UV light, but also by means of laser activation. 3D MID LDS (Laser Direct Structuring) utilizes a laser to define the desired lines on the material surface prepared with CMB chemistry. The Cuptronic MID process exhibit many great advantages compared to the common industrial MID technologies.

The result of the above video:











“No” real limits exist to the fineness of the line widths achievable through the CBM process, and the restrictions are set by the equipment used to define the lines. Prof. Delsing’s target is lines of 1 µm. Currently, the highest line precision has been 7 µm, achieved only in a laboratory environment.

CBM chemistry applied on the whole surface and lines defined (activated) by a laser (courtesy of Prof. Delsing, Luleå University of Technology):
3D MID, LDS – activation