Selective metalization – sub 5 μm

Requirement:

Sub 5 μm selective metalization

Solution:

CBM process and activated (design) with UV laser

CBM chemistry applied on whole surface and lines defined (activated) by laser.

Line width limited primarily by equipment used to define lines. Target is 1 μm lines.

Laser line definition process currently only implemented in lab environment.

Courtesy of Prof. Delsing, Luleå University of Technology

Double square SRR with strip line 3 μm after copper metalization

 Double circular SRR with strip line 3 μm after copper metalization