High frequency


  • have true rectangular conductors,
  • have a 1-to-10 plating ratio on surfaces as well as in holes, and
  • have no “tabs” that mechanically hold the copper onto the laminate.

Improving these qualities enables superior signal response for high frequency applications.

By achieving good adhesion also on “new” materials, the Cuptronic Process™ further strengthens its ability to enhance high frequency performance.

Thanks to its precision, the Cuptronic Process™ also opens for discrete high frequency components to be printed directly onto PWBs, rather than applied as packaged components.

48-micron lines produced using the Cuptronic Process™ and conventional equipment:
PCB, High frequency – tighter lines and spaces












Rogers substrate after solder chock:
PCB, High-frequency – 1-to-20 ratio on surfaces and in holes